Kur pirkti

ASBIS tiekia didelį asortimentą IT produktų savo klientams Lietuvoje. Aplankykite skilti kur pirkti ir sužinokite kur yra artimiausia parduotuvė

ASBIS naujienos

Kovas 18, 2024
Intel® Ethernet 800 Series Network Adapters support speeds up to 100Gbps and ...
Kovas 12, 2024
AI Leaders and Top Companies From Healthcare, Transportation, Financial ...
Kovas 11, 2024
At MWC 2024 in Barcelona, Intel announced its future Intel® Xeon® processor ...
Kovas 08, 2024
Recognized for Marketing Excellence and Received TikTok for Business Overseas ...
Kovas 01, 2024
Solidigm D5-P5336: Massive Capacity, Minimal Cost
Vasaris 27, 2024
Dell Technologies introduces new edition of RISE Partner Program. The new ...
Vasaris 26, 2024
From 18 to 21 March ASBIS together with AMD, innovator of high-performance ...
Vasaris 23, 2024
Edgecore Networks, a leader in open networking solutions, has introduced the ...
Vasaris 23, 2024
Ubiquiti, a global networking technology leader, announced the release of two ...
Vasaris 22, 2024
We are thrilled to announce the launch of our newly redesigned B2B shop, packed ...
Invisible Heat Sink, Incredible Performance

Rugsėjis 09, 2010

Invisible Heat Sink, Incredible Performance

KINGMAX launches the world’s first DRAM module with Invisible Heat Sink.

BUY ONLINE

Available for order
in September 2010

 
 

KINGMAX, a global leading manufacturer of DRAM and flash products, announced the launch of the world’s first DDR3 2200MHz DRAM module with Nano Thermal Dissipation Technology (named Invisible Heat Sink). 

The new KINGMAX DDR3 2200MHz memory module, which presents the best efficiency running at the highest bandwidth up to 17.6GB/s, allows more data input and increases the system operating capability, is a perfect fit for enthusiasts, gamers and bench-markers. Currently, KINGMAX applies the technology onto its overclcking Hercules series including 1600MHz, 2000MHz and 2200MHz.

“KINGMAX is pleased to launch the new KINGMAX DDR3 2200MHz, which is a breakthrough in technology.  It is the first DRAM module adopted Nano Thermal Dissipation technology (which named “invisible heat sink”) in the world. Nano Thermal Dissipation Technology is to utilize nano-sized silicon and DLC(diamond-like-carbon) compound as the medium to increase the release of radiant heat.  With KINGMAX’s advanced packing technology to integrate the material onto the chips, it shows great effect to pull the heat from the surface at a faster rate than the normal heat sink. “By adopting the invisible heat sink, it provides superior heat dissipation effect to boost overclocking performance and stability of the system.” Says Mr. Matt Kao, Product Manager at KINGMAX. “Compared to the normal heat sink, which usually equips on the DRAM module, the KINGMAX DDR3 2200 MHz has the advantage of compact size which improves the air flow inside the case. The no power request design also offers an economical operating environment, as well as compact product and package design reduces extra waste and transportation to green the environment.”  Mr. Kao adds.

KINGMAX Group is the world’s first RAM/memory card module manufacturer that features vertical industrial integration capabilities and solid R&D capability and innovative cutting-edge patented technology. Upholding “Quality comes from perfection in technology”, KINGMAX insists on and endeavours for continual innovation. Its faith in its unique products ensures they continue to take the world by storm. In addition, all KINGMAX products undergo rigorous testing before delivery to ensure the best quality. Lifetime warranty services are also provided so you can set your mind at rest when buying the products.  KINGMAX products have been passed the SGS testing and compliant with RoHS standard. For more information please visit http://www.kingmax.com

Features of KINGMAX Long-DIMM DDRIII 2200 Dual-Channel:

  • Support Intel P55 Chipset
  • Adopting Nano Thermal Dissipation Technology
  • ASIC chip embedded for anti-counterfeiting purpose
  • Lead-free production process
  • TinyBGA™ technology adopted: with advantages as compact size, well heat dissipation and low EM interference
  • 100% product compatibility and stability
  • High data transfer performance for overclocking enthusiasts and hardcore gamers
     

Specification of KINGMAX Long-DIMM DDRIII 2200 Dual-Channel Kit:

  • 240-pin DDRIII 2200MHz
  • CAS Latency:10
  • Bandwidth:17.6GB/sec
  • Voltage: 1.5~1.7v
  • Capacity: 4GB (2GB*2) Dual channel kit
  • Worldwide Lifetime Warranty
     


Related news about KINGMAX products

 

 

Disclaimer:: The information contained in each press release posted on this site was factually accurate on the date it was issued. While these press releases and other materials remain on the Company's website, the Company assumes no duty to update the information to reflect subsequent developments. Consequently, readers of the press releases and other materials should not rely upon the information as current or accurate after their issuance dates.